DryScrub Electrochemical Technology Corp

DryScrub® System

Plasma Trap

The technology leader in particle reduction and exhaust abatement innovations to enhance process performance, protect equipment and save the environment

2DH with 2nd generation technology

With newly patented plasma technology and an ingenious design, the 2DH model is very compact for installation in small spaces. This genuine, point-of-use, high performance plasma trap has been proven to reduce pump and valve failures, exhaust line clogging, fire and explosion problems, airborne powder contamination, system downtime, costs of ownership, and wafer particle counts. It abates more than 99.5% CVD gases and over 95% PFC gases. Operating cost is less than $2,000.

Specifications

Chamber: Operating Pressure - 13 t2,700Pa (0.1 t20Torr)
Dimensions: 420 mm H x290 mm W x 290mm D.
Mating Flange, Top and Bottom: ISO80/100 Bolt/Clamp Flanges.
Flange tFlange separation: 350mm
Clearance: Top and Bottom 10 mm; Side 5mm
Front Clearance for Service 300mm H x 310mm W x 300mm D
Weight: Removable Center Cylinder: 5.2kg, Top and Bottom plates: 8.8kg.
Chamber Mounting Bolts: M8 (Metric Bolts)
Installation Orientation: Any Orientation
Electrode (New Patent Application): Material 316L Stainless steel (reusable)
Weight: Empty Approximate 7 kg
Loaded up t 2 t20 kg additional waste - process-dependent
Dimensions 254 mm OD x 300mm H
Electrode Surface Area > 2.7 M2
Solid Waste Volume > 2,000 cm3
Operating time between cleanings: process-dependent, 1 t12 Months Reusable - In-situ Etch Cleaning or External Cleaning
RF power supply: RF Power Supply: Seren IPS, 100kHz, Model L2001H.
Dimensions, 7" H x 19" W x 23" D.- Weight: 70 pounds.
Line: 190-264VAC, Single Phase, 60/50 Hz, 25 Amps.
Water Cool: 2GPM
Maximum Power: 2000 watts.
Matching Transformer and Cables Included