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F&K Enterprise
- 66000/64000 Large Area Hybrid Ball Bonder. .0007"—.020"
- F&K Delvotec's 5th generation wire bonder chassis developed for heavy wire bonding applications and fine wire bonding applications. This is a new chassis currently in beta site stage and making the trade show circuit. It is not yet available for sale. Orders may be accepted Q3-4 of 2004. Many performance and technology advancements have been made over the 4th generation equipment line.
- 5310 Manual Ball Bonder
- The 5300 series is perfect suited for complex bond-tasks optimal quality at the most favourable price, this machine is the right choice for such applications. Since the machine offers a motor-driven motion in Z-axis the bonder can carry out the bond without operator intervention. The operator can create different kinds of loops with the manipulator system. Operators require only a minimum of training, making the 5310 manual ball bonder the ideal choice for proto-type, rework and small-scale production.
- Integrated Lines customised to the application
- Including magazine to magazine lines involving die bonders, wire bonders, cure ovens, plasma cleaners, material tracking, post inspection, auto de-tabbers and even automatic ink marking. F&K can provide custom integrated line variations involving wire bonders offering wedge bonding, ribbon bonding, ball bonding and heavy wire bonding connected to feature loaded epoxy die bonders.
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