Yield Engineering Systems Inc

YES has been providing a range of process equipment to the semiconductor industry since 1980. We now have a complete line of products including the YES-450PBX4-300 fully automated 300 mm tool for Copper Anneal, Polyimide, or BCB Bake. Also in Our Newest Products department is the YES-1224 Silane Deposition System for the Bio-medical industry.

450°C PB Series High Temperature Vacuum Cure Ovens

Our systems are designed to be used for many different processes

YES-Series Vacuum Bake/Vapor Prime and Image Reversal Systems

The one-step YES systems provide a straight-forward, pre-programmable environment for total dehydration and HMDS prime deposition. The latest technique of applying HMDS (hexamethyldisilizane) is vapour priming. In this process, the wafers are bathed in HMDS vapours, creating several advantages.

YES-PBV300 & YES-PBV300/1224

The Yield Engineering Systems YES-PBV300 is an automated, controlled-atmosphere, vacuum thermal processing system with a SEMI standard compatible 300mm FOUP load port and robotic loading of wafers from the FOUP into the oven vacuum chamber.

YES G1000 Plasma Cleaning System

Plasma Cleaning has replaced "conventional" cleaning techniques in a myriad of applications. Plasma requires no CFC's, no chemical cleanup, and leaves no solvent residues on sample surfaces. Byproducts of the plasma process are generally totally inert and are released in gaseous form to be evacuated through the system exhaust. Current technologies that use plasma to clean, strip or to surface modify their products include the hybrid, bio-chip, automotive, medical, flat panel, semiconductor, plastics and optics industries.

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